Tevo – Menzerna Medium Cut Compound 2000

Menzerna Medium Cut Polish 2000 (MCP 2000) is the classic Medium Cut Polish. It is ideal for the removal of scratches, sanding marks on fresh coatings and signs of use or washing. Furthermore it generates gloss.

How to Use:
1. Clean surface thoroughly prior to polishing.
2. Shake the bottle prior to use and apply the following quantity of the product onto the
polishing pad.
Recommendation for a 40cm x 40cm area:
Pad with a diameter of 95mm: 3-4 pea-sized drops
Pad with a diameter of 150mm: 5 pea-sized drops
Pad with a diameter of 180mm: 6-7 pea-sized drops
3. For removing scratches, sanding marks with fresh paint, washing and usage marks use Menzerna Medium
Cut Foam Pad.
4. Use either a rotary or an orbital polishing machine and use the cross-coating method.
Apply medium, even pressure while polishing and extend the product with a constant medium machinespeed.
5. At first, the polish will seem a little milky and should be worked in until only a slightly transparent/oily film is visible.
6. Once you have finished polishing, remove any residue with our Premium Microfiber cloth, without applying any pressure.
7. Any signs of sanding marks and use have now been removed. For the removal of any holograms and an exceptionally glossy finish, now apply one of our Menzerna Finishes.

Product Benefits:
1. minimal usage
2. user friendly
3. lesser polishing residue.
4. best to remove swirl mark and genarate gloss.

Products Specification: 1 Litre, paste type.

Menzerna中等切割抛光剂2000（MCP 2000）是经典的中等切割抛光剂。它非常适合去除新涂层上的划痕、砂磨痕迹以及使用或清洗痕迹，并能产生光泽。

使用方法：
1. 在抛光之前彻底清洁表面。
2. 使用前摇匀瓶子，根据以下建议量将产品涂抹在抛光盘上。
建议用于40厘米 x 40厘米区域：
直径95毫米的盘子：3-4颗豌豆大小的涂抹
直径150毫米的盘子：5颗豌豆大小的涂抹
直径180毫米的盘子：6-7颗豌豆大小的涂抹
3. 用于去除新涂层上的划痕、砂磨痕迹以及清洗和使用痕迹，使用Menzerna中等切割泡沫盘。
4. 使用旋转式或偏心式抛光机，并采用交叉涂覆方法。在抛光时施加中等而均匀的压力，并以恒定的中速度操作产品。
5. 初始时，抛光剂可能会显得有些乳白色，需继续工作，直到只剩下略透明/油膜可见。
6. 完成抛光后，用我们的优质微纤维布擦拭去除任何残留物，不需要施加压力。
7. 现在所有的划痕痕迹和使用痕迹都已经被去除。为了去除任何全息图案并获得异常光泽的表面，现在可以使用我们的Menzerna抛光剂之一。

产品优势：
1. 使用量最少
2. 用户友好
3. 抛光残留物更少
4. 最适合去除旋转痕迹并产生光泽

产品规格：1升，膏状。